CNBM: Intends to issue no more than 2 billion yuan of technology innovation corporate bonds

2026-08-20 11:14:26

On August 17, China Building Materials (03323. HK) announced that in 2026, China Building Materials Co., Ltd. will publicly issue technology innovation corporate bonds (the fifth issue) (hereinafter referred to as "the current issue of bonds") to professional investors as the seventh issue of this bond, with the issuance scale not exceeding 2 billion yuan (including 2 billion yuan). The Bonds are intended to be publicly issued to professional institutional investors and listed on the Shanghai Stock Exchange.

bonds is referred to as Building Materials K25, and the bond code is 245903.sh; the second type of bonds is referred to as Building Materials K26, and the bond code is 245904.sh.

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Correlation

CNBM: Intends to issue no more than 2 billion yuan of technology innovation corporate bonds

2026-08-20 11:14:26

CEMPI

91.84

-0.01 -0.01%

CONCPI

86.97

-0.05 -0.06%

CLKPI

96.87

0.00 0.00%

SPPI

41.51

0.00 0.00%

MORPI

73.32

0.00 0.00%

Conch Cement: net profit in the first half of the year was 2.527 billion yuan, down 42.76% from the same period last year.

On the evening of August 26, Conch Cement disclosed its semi-annual report that in the first half of the year, the company realized operating income of 36.927 billion yuan, down 10.88% from the same period last year; the net profit attributable to shareholders of listed companies was 2.527 billion yuan, down 42.76% from the same period last year; the basic earnings per share was 0.48 yuan/share.